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MIJING

MiJing CH5 Motherboard Heater Preheater Layering Welding Platform for iPhone 12 Series, US Plug

MiJing CH5 Motherboard Heater Preheater Layering Welding Platform for iPhone 12 Series, US Plug

Regular price Rs.18,338.11 INR
Regular price Sale price Rs.18,338.11 INR
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Shipping calculated at checkout.

In stock

Quantity

🔥 Buy 2 items, get 25% off 3rd item 🔥 hurry while stock lasts!

Pay using Mobicred. Simply choose Peach Payment >> Mobicred at checkout, and we’ll ship it once the order is approved.

FREE SHIPPING at checkout. Ships via Buffalo Logistics. Fully insured.

Handling time: 1 - 3 working days. (PMC has to process your order and put all your items through its strict quality-control tests.)

Transit time: 5 - 10 working days.

Overseas Warehouse: Shipping from China.

Duties and Taxes

  • For orders up to and including R2000 - No Additional Charges: The price you see is the final price—no hidden costs or extra taxes.
  • For all orders over R2000, we are unable to offer DDP (Delivered Duty Paid), and you will be responsible for any import duties, taxes, and customs clearance fees.

For whatever reason, if you are unsatisfied with your order within 7 days, you can return it to us in new condition.

Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.

If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. PMC will make compensation based on the damage situation.

1. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
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