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AMAOE For Samsung BGA Reballing Stencil Soldering Repair Tool, Model: SAM21 S25/S25+

SKU: TBD0606473807
Sale Sold out Pre-order
Regular price R 199.00
Regular price Sale price R 199.00
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Description

AMAOE BGA Reballing Stencil is a soldering repair tool designed for reballing various Samsung CPU models. It is applicable in repairing devices such as Samsung S21, S22, and S23 series smartphones.

  • Model: SAM21
  • Function: BGA reballing stencil for soldering repair
  • Compatible CPUs: Qualcomm Snapdragon 888, Exynos 2100, Exynos 1280, Exynos 2200, Snapdragon 8 Gen 1, Snapdragon 8 Gen 2, Snapdragon 8 Ultimate Edition, MediaTek Dimensity 6100+
  • Compatible Devices: Samsung S21, S21+, S21 Ultra, Z Flip 3, Z Fold 3, W22, S22, S22 Plus, S22 Ultra, S23, S23 Ultra, S24, S24 Ultra, A14, A54, A53, A536, A156U, A156E, S25, S25 Plus
  • Material: Metal
  • Dimensions: Not specified
  • Warranty: 6-Month Warranty
  • Shipping: FREE Shipping

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